Micron Invests $2.75 Billion To Open Chip Assembly Plant As India Expands Packaging

India is adding chip packaging to its semiconductor roadmap, shifting from design and wafer fabrication toward assembly, a move highlighted at the recent SEMICON INDIA 2026 conference and reported by EE Times.

Micron announced a $2.75 billion investment to build a chip assembly plant in India, marking the memory company's first large‑scale packaging facility in the country and signaling confidence in the emerging local ecosystem.

The plant will focus on packaging memory and logic devices, creating a domestic link between Indian wafer producers and international customers, and reducing the need to ship unfinished chips to overseas packaging sites.

Industry analysts view the development as a step toward a more self‑reliant semiconductor supply chain in India, aligning with government plans to boost local manufacturing and likely to attract additional foreign equipment suppliers.